| Posted by Jade Po Kellard on 17 April 2009 at 06:00
|
The SMTA and MEPTEC are pleased to announce the combination of their 2009 Medical Electronics Symposia. The two-day technical program will be held September 16-17, 2009 in Phoenix, AZ. ASU’s College of Nursing and Healthcare Innovation will co-sponsor this event.
Conference Chairs Dale Lee (Plexus Corporation), Nick Leonardi (Premier Semiconductor Services), Ron Molnar (AZ Tech Direct), and Dave Ruben (Medtronic Microelectronics) cordially invite you to submit an abstract for consideration.
This symposium will focus on medical electronics and medical device applications. The technical committee is soliciting abstracts from within the medical community that will share the most up to date information about company electronics expertise, practices, technology and applications as it relates to the symposium topics.
Please provide an abstract (250 word minimum) on any of the symposium topics or other relevant topics to the Conference Coordinator, Melissa Serres Marx via email to melissa@smta.org no later than May 29, 2009. There is no technical paper requirement for this symposium. Presentations are due on September 1, 2009.
Session topics include:
• Market Trends & Forecast in Medical Electronics
• Emerging Materials & Technologies
• Component Manufacturing, including Sensors (chip & packaging level, etc.)
• End Products and Applications - instrumentation (defibrillators, etc.)
• Materials and Design
• Systems Manufacturing (ie. PWB/PCB assembly, stacked packages)
• Reliability/Safety/Regulatory/Testing
• End Products and Trends - internal (implantable)
The abstract and presentation must be non-commercial in nature and emphasize the medical technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission.
Contact Melissa Serres Marx at 952-920-7682 or melissa@smta.org with questions or comments.
Watch for additional symposium information at http://www.smta.org/education/symposia/symposia.cfm#medical. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 