MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized its program for the 7th Annual MEMS Packaging symposium titled "MEMS Innovation - Growth Engine in Rich and Lean Times" on May 14, 2009.  This special one-day event will take place at the Wyndham Hotel, San Jose, CA.
 
The event will begin with a keynote presentation by Dr. Beth Pruitt, Professor of Mechanical Engineering, Stanford University.  In her presentation, "A Look at MEMS for Biology and Medicine", Dr. Pruitt will present a range of applications that require MEMS to operate in biological environments with excellent signal fidelity and reliability and will also review opportunities, needs, and challenges for applying MEMS and microfabrication techniques to fundamental in vitro biology questions as well as translational medical problems.
 
MEPTEC is also pleased to have a special report following the keynote presented by Tina Lamers of axept (representing MIG).  In her presentation, "Growth Opportunities for MEMS in a Changing Economy", Ms. Lamers will present the outcomes of some of the working groups from METRIC 2009, the annual meeting for members of MEMS Industry Group (MIG), which can benefit all companies in the MEMS industry.
 
Building on the success of their prior MEMS symposiums over the past six years and continuing with its proven symposium format, MEPTEC will bring together another group of technical speakers who are considered experts in the MEMS field.

Sessions and speakers include:

Enabling Technologies for Microfabrication

Session Leader:  John Heck, Intel
 
Claudio Truzzi, Ph.D., Chief Technology Officer, Alchimer  - Electrografted Film Deposition for Deep TSV Structures
 
Jay Mitchell, President, ePack, Inc. - MEMS Wafer-Level Vacuum/Hermetic Packaging Technologies
 
John McKillop, Managing Director, Tekton Consulting, LLC, Presenting on behalf of NEC Schott - HermeS: Hermetic Packaging System for MEMS
 
Innovation in MEMS Materials

Session Leader: Janusz Bryzek, Ph.D., MEMS Industry Pioneer
 
Ariel Cao, Director Business Development, TRONICS Microsystems North America - New MEMS Foundry Paradigm: Unique MEMS Components and Materials for Unique Customers
 
Shad Roundy, Director of Sensors and Packaging, LV Sensors - Effective Design and the Use of New Materials
 
Arthur Chait, President and CEO, EoPlex Technologies, Inc. - Bridging the Gap Between Macro and Micro Devices for Manufacture of Piezoelectric Energy Harvesters
 
MEMS Innovation as Enabler for Cutting Edge Medical Products

Session Chair:  Sean Cahill, Bridgewave Communications
 
Jeremy Frank, Ph.D., MEMS Manager, Proteus Biomedical, Inc. - Intelligent Medicine: MEMS Innovations Applied to Medical Therapies
 
Adam Cohen, Executive Vice President, Technology and Chief Technology Officer, Microfabrica Inc. - 3-D Metal Micro-Manufacturing Technology for Miniature Medical Devices
 
Brian Sullivan, Ph.D., Director of Research, Kumetrix, Inc. - MEMS Applications in Health Care
                                                                                                                                         
Consumer MEMS Becoming a Dominant Market Force

Session Chair: Joseph Mallon, axept / Stanford University
 
Jeffrey Perkins, General Manager, Yole, Inc. - MEMS in Cell Phones: It's About Value
 
Scott Smyser, Vice President & General Manager, VTI Technologies, Inc. - Self Contained Pedestrian Navigation Using Inertial Sensors
 
Manish Kothari, Sr. Director, Business Operations, Qualcomm MEMS Technologies - Large Area Consumer MEMS Devices - Challenges & Opportunities
 
Janusz Bryzek, Ph.D, MEMS Industry Pioneer - BioMEMS: Disruptive Technology for Personalized Medical Care

About MEPTEC
MEPTEC (Microelectronics Packaging and Test Engineering Council) is the trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business.  MEPTEC is concerned exclusively with assembly and testing and is dedicated to the advancement of the industry.  Since its inception 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test and handling.  Through their membership of subcontractors, semiconductor manufacturers and vendors to the back-end, and an advisory board consisting of individuals from different segments of the back-end semiconductor industry, they continuously strive to improve and elevate the roles of assembly and test professionals in the industry.  More information about MEPTEC can be found at www.meptec.org.

Keywords : Association News, North America, MEPTEC Finalizes Program for MEMS Symposium

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