| Posted by hglackey on 01 May 2009 at 09:46
|
April 2009 (Volume 9, Issue 4)
 Read the European edition online (or download the PDF).
Read the Americas edition online (or download the PDF).
Editorial
The end is near
Trevor Galbraith
Technology Focus
Hot air solder leveling in the lead-free era
Keith Sweatman, Nihon Superior Co., Ltd
Vapor phase vs. convection reflow in RoHS-compliant assembly
Dan Coada, EPIC Technologies
Conquering SMT stencil printing challenges with today’s miniature components
Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.
Special Features
Interview: Krassy Petkov—Milara, Inc.
APEX preview
Regular Columns
Conformal coating process control and inspection
Bob Willis
IC packaging technology retrospective—part 2
Joe Fjelstad
Bottom reached, ‘turning point’ in sight?
Walt Custer and Jon Custer-Topai
Other Regular Features
Industry News
New Products
Association News
On Globalsmt.net
International Diary
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 