April 2009 (Volume 9, Issue 4)

Read the European edition online (or download the PDF).

Read the Americas edition online (or download the PDF).

Editorial
The end is near
Trevor Galbraith

Technology Focus
Hot air solder leveling in the lead-free era
Keith Sweatman, Nihon Superior Co., Ltd

Vapor phase vs. convection reflow in RoHS-compliant assembly
Dan Coada, EPIC Technologies

Conquering SMT stencil printing challenges with today’s miniature components
Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.

Special Features
Interview: Krassy Petkov—Milara, Inc.
APEX preview

Regular Columns
Conformal coating process control and inspection
Bob Willis

IC packaging technology retrospective—part 2
Joe Fjelstad

Bottom reached, ‘turning point’ in sight?
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Association News
On Globalsmt.net
International Diary 

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