| Posted by Keith Sweatman, Nihon Superior Co., Ltd. on 08 May 2009 at 09:55
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Although the advantages of hot air solder leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized, in the years leading up to the implementation of the EU RoHS Directive in July 2006, the conventional wisdom was that it would have no place in the new lead-free electronics manufacturing technology.
By July 2006, however, there were nearly 200 lead-free HASL lines running in Europe, and that number has continued to increase since then. In the more than 5 years in which the lead-free HASL process has been used in commercial mass product, much has been learned about the operation of the process on the optimization of results. In this paper the author will report on current best practice on the operation of lead-free HASL lines and the properties that can be expected of a properly applied lead-free HASL finish.
Read the full article online.
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 