This article discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost-effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions and significant cost savings.

One of the challenges facing OEMs and CMs in building assemblies with miniature components is the stencil printing process. Many of today’s designs incorporate a mix of miniature and much larger components. Manufacturing engineers are faced with the dilemma of choosing a thinner stencil foil to ensure solder paste release for the miniature components or a thicker foil to ensure sufficient solder volume for the larger components. With a standard laser-cut stencil using 300 series stainless steel, one would have to make that difficult choice. 

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