| Posted by Dan Coada, EPIC Technologies on 08 May 2009 at 09:59
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The contract manufacturing industry is changing rapidly from lead-based soldering to lead-free soldering. There is no stopping the transition or the reality that lead-free components are going to be introduced in lead-based processes. This challenge to engineering and quality is a huge concern and one that needs scrutiny and a watchful eye. EMS providers rely on component suppliers to ensure that the lead-free transition on the component terminations is seamless to their soldering processes, but that rarely happens. Termination changes require additional modification to solder profiles and flux chemistries in order to ensure proper wetting of the solder to the lead-free termination. The need for nitrogen to be used in convection reflow is becoming a requirement more than an option, and nitrogen is costly.
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 