KIC announces that it has been awarded the 2009 EMAsia Innovation Award in the category of Process Control Software for its RPI in-line inspection system. The award was presented to the company during an April 22, 2009 ceremony that took place at the Shanghai Everbright International Hotel during Nepcon China 2009.
 
The RPI is an in-line process inspection system for SMT reflow ovens. The system is embedded inside the reflow oven and on a daily basis, it will generate two charts: DPMO and Process Yield for the thermal process.

The RPI complements the working of AOI and x-ray systems, especially for BGAs and other area array packages.  The AOI system is not designed to look at joints hidden under the component’s body as in the case of BGA, PoP and other such components.  X-ray inspection will see through the component body onto the joints.  The RPI, however, “inspects” the process that these joints endured, and will reveal whether the thermal process was conducted to spec.  There are numerous defects associated with solder joints that have been processed out of spec.  Examples include inadequate wetting, too large or too small grain structure, and even certain types of opens and cold soldered joints.  The RPI inspects the core of the issue that, to a large degree, determines the joint quality or defects: Were the products processed within the relevant thermal process parameters? 

Finally, rather than overwhelming the manager or engineer with data, the RPI generates only two datapoints (DPMO and Yield) in a simple chart to tell if the thermal process is healthy or not.

Established in 2006, EM Asia Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward. For more information, please visit www.emasiamag.com/awards2009.

www.kicthermal.com

Keywords : Industry News, China, KIC’s RPI Wins the 2009 Innovation Award

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