Tin whiskers remain a serious reliability concern in electronic products and systems. CALCE along with SMTA, the Technical University of Denmark, and Osaka University will hold the Third International Symposium on Tin Whiskers, June 23-24 at the Technical University of Denmark. This symposium will cover case histories, theories of tin  whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies.

Attendees will be able to learn about the current state of knowledge regarding tin whisker growth, risk, and mitigation strategies, enabling the development of improved and effective qualification and mitigation procedures.

Read more about the symposium agenda.

Registration and hotel information can be found at http://www.smta.org/education/symposia/symposia.cfm#tin-whiskers.

Keywords : Association News, International, 3rd International Symposium on Tin Whiskers - Register Now

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