(Part one, Part two - will open in new window) 

Part 2 of this retrospective, seen in last month’s issue of Global SMT and Packaging, took a bit of a detour from the topic to explore the reasoning and the impact of the ‘80% Rule’ (which was adopted for the road mapping of early surface mount package I/O pin outs) to illustrate how that rule had an unintended but deleterious effect on design as the industry transitioned to more dense area array packaging. The topic of area array packaging will be covered in more detail in a later part of this series; however, at this time we will pick up again on the progress of IC packaging technology evolution and early surface mount packages. 

Read the full column online.

Average user rating

   (0 vote)