| Posted by Joe Fjelstad on 08 June 2009 at 14:05
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(Part one, Part two - will open in new window)
Part 2 of this retrospective, seen in last month’s issue of Global SMT and Packaging, took a bit of a detour from the topic to explore the reasoning and the impact of the ‘80% Rule’ (which was adopted for the road mapping of early surface mount package I/O pin outs) to illustrate how that rule had an unintended but deleterious effect on design as the industry transitioned to more dense area array packaging. The topic of area array packaging will be covered in more detail in a later part of this series; however, at this time we will pick up again on the progress of IC packaging technology evolution and early surface mount packages.
Read the full column online. |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 