Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

Jetting fluids in non traditional packaging and assembly applications PDF Print E-mail
 

Posted by Alec J. Babiarz on 08 June 2009 at 14:30

The expansion of business into alternative energy, green components and energy-efficient components is having a significant impact on the electronics and semiconductor industry. In solar cell production using wafers or printed electronics, the application of fluids to the end product is part of the function of the product rather than just a packaging process.

 

Energy efficient lighting using LEDs depends upon the function and proper deposition of phosphor-filled silicones. Fuel cell proton exchange membrane manufacturing depends upon fine and uniform film builds of carbon platinum dispersions and nafion using jet spraying technologies. Some new fuel cell technologies are being developed directly on silicon wafers for mobile power applications. As the industry continues to move to more green focused manufacturing, new materials and processes are being introduced to mitigate the high price of gold wire bonding. Jetting of a wide range of materials has enabled the advancement of these new products. 

Read the full article online.

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Keywords : Jet, Underfill, Fuel Cells, Stacked Die, ODF, FPD


Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Featured Interview

Interview - Terry Heilman, Sunstone Circuits
Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
 

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff