You are invited to submit an abstract to the SMTA's newest technical event in Penang, Malaysia.

Presentations are sought in the following key technology tracks:

Assembly
•  Lean manufacturing
•  Low volume/Prototype assembly
•  Medical electronics
•  Rework and repair of QFN's
•  Selective soldering
•  Set up reduction
•  Vapor phase reflow for high reliability assemblies
•  Yield improvement
•  Under fill applications and issues

Emerging Technologies
•  Embedded technology/Actives and assembly
•  Optoelectronics
•  Solar technology
•  System in a Package
•  Power and thermal management

Components
•  Chip scale packages, including WL-CSP, LGA
•  Multichip packages, including 3D packaging
•  Tin whiskers  Emerging Technologies

Harsh Environment Applications
•  Lead-free issue for harsh environments
•  Potting
•  Conformal coating

PCB Technology
•  Black pad and surface finish defects
•  Halogen-free, ROHS, green products requirements

Abstracts (300 words) are due July 6, 2009. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Please include your contact information (address, phone number, email address) and a presentation title with your abstract submission.

Contact the Conference Coordinators, Melissa Serres Marx at melissa@smta.org or Bernie Selva at bernie@smta.org, with questions or comments.

Visit http://www.smta.org/education/education.cfm#asia_pacific for more information and to submit your abstract for the 2009 program.

Keywords : Association News, International, South East Asia Technical Conference on Electronics Assembly Technologies

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