| Posted by Jade Po Kellard on 18 June 2009 at 06:00
|
The SMTA and CALCE/University of Maryland are pleased to announce their industry premier in Denmark with the International Symposium on Tin Whiskers. The event is supported by the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.
The 3rd International Symposium on Tin Whiskers will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies. Attendees will be able to learn about the current state of knowledge enabling the development of improved and effective qualification and mitigation procedures.
Presentations given by:
• Purdue University
• NASA
• Nippon Avionics Co.
• National Institute of Standards & Technology
• Enthone Inc.
• CALCE/University of Maryland
• Senju Metals
• Yokohama National University
• and more...
Exhibit Opportunity
Interested companies can register for tabletop exhibit space at the International Symposium on Tin-Whiskers. Tabletop exhibits will be located outside of the symposium room and near the registration area. The cost to exhibit is $305 for members of the organizing groups, and $405 for non-members.
The symposium is organized by SMTA in conjunction with the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD and the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.
Questions? Contact Melissa Serres Marx at 952-920-7682 or melissa@smta.org or visit the SMTA Education & Events page. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 