Global SMT & Packaging magazine - Interview

News

Videos up now!

2009 Show Review

Industry Blogs

Top blogs

Feed

Global SMT RSS feed

Interview—Jeff Timms, Microscan

Posted by hglackey on 17 June 2009 at 15:49

Jeff Timms, president of Microscan since 2007, has been focusing these past two years on using his 25 years of business leadership in global technology and automation to bring the company to the forefront of the precision data acquisition and control solutions industry. Prior to Microscan, Jeff held senior management positions with both Siemens and Universal Instruments. Global SMT & Packaging’s editor-in-chief Trevor Galbraith caught up with Jeff recently.

Read the full interview online.

Users' Comments

Average user rating

(0 vote)

Add your comment

[+] Show form

[-] Hide form

No comment posted

mXcomment 1.0.9 © 2007-2010 - visualclinic.fr
License Creative Commons - Some rights reserved

Related Items

No related items

EU/US edition

China edition

Korea edition

2009 Show Preview

Featured Interview

Interview - Terry Heilman, Sunstone Circuits

Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.