| Posted by Jade Po Kellard on 26 June 2009 at 06:00
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A significant focus at the October Fastening Solutions Exhibition will be on industrial and engineering adhesives, which are increasingly used where cost-reduction is a key driver.
Mark Newby, M.D. of organisers Newbycom voiced the view that “Our adhesives exhibitors continue to find new applications where their technology enhances products and processes while reducing costs. Often manufacturers have not even considered adhesives but within the framework of the Fastening & Assembly Solutions Exhibition, face to face, they can discuss quickly and in depth with top experts – something they cannot do online or even by phone.”
This is exemplified by exhibitors such as Henkel Loctite: www.loctite.co.uk who cover bonding, sealing, retaining, threadlocking and gasketing. Elsewhere in the hall ThreeBond: www.threebond.co.uk can address liquid/adhesive sealants as well as anaerobic, pressure sensitive, UV curing, cyanoacrylate adhesives. Key providers Inseto: www.inseto.co.uk offer high grade anaerobics, 2 part polyurethanes, 1 and 2 part epoxies and light/anaerobic curing adhesives.
Another October exhibitor will be Fospat Industrial Ltd: www.fospat.com, specialising in hot-melt adhesives and application equipment. In addition, Viking Industrial Products: www.vikingtapes.co.uk will have on-hand expertise to provide engineers with advice regarding 3M tapes and adhesives as well as explaining the cost advantages they have demonstrated in previous applications.
The Fastening & Assembly Solutions Exhibition takes place at the National Motorcycle Museum on October 29th 2009. The venue is adjacent to the NEC and offers plenty of free parking right outside the main entrance. VIP Visitors to the show (i.e. currently employed manufacturing professionals) who pre-register in advance have the added advantage of a free Luncheon Voucher, and all visitors also receive a free museum pass (otherwise costing £6.95). Pre-registration may be done at www.fastening-solutions-exhibition.co.uk. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 