| Posted by Jade Po Kellard on 29 June 2009 at 06:00
|
 Cardinal Components, Inc., a world leader in the manufacturing of programmable oscillators, is introducing a programmable Spread Spectrum Oscillator from 1.5 to 200 MHz with samples delivered in 48 hours. Cardinal’s Spread Spectrum Oscillator “CSSC” is a special designed digital clock oscillator that lowers a product’s electromagnetic interference (EMI) outputs when compared with a conventional clock generator. Cardinal’s Spread Spectrum Oscillator “CSSC” reduces the amount of EMI radiated from an electronic system, which is one of the hardest problems to resolve in lowering system costs. The Cardinal Spread Spectrum Series offer cost-effective EMI reduction, helping designers pass FCC regulations.
The first in the series “CSSC” is a 5 x 7 mm and 5 x 3.2 mm surface mount programmable with HCMOS output. The device is pin compatible with conventional SMD oscillators making its use a simple drop-in replacement. The “CSSC” device operates at 3.3 and 2.5 volts. It’s available in an industry standard 5 x 7 mm and 5 x 3.2 mm surface mount package (4 pads) ceramic hermetically sealed construction. Additional features include stability options of 50 and 100 PPM maintained over temperature ranges of (0 C to +70 C) (-20C to +70C) and (-40C to +85C).
The Center Spread is + 0.25% + 2%, and the Down Spread is –0.50% -4% making the CSSC suitable for applications such as Copiers, LAN, Printers, Scanners, Industrial Automation, Consumer Electronics, and markets requiring rapid EMI resolution for products going to production quickly.
Samples of this device can be obtained by contacting Cardinal or one its authorized distributors worldwide. Sample quantity pricing is in the $4.00 range, and 1k-volume pricing is $1.75 each for the HCMOS version in the 5 x 7 mm ceramic package.
You can learn more about Cardinal Components, Inc., and Cardinal's additional products by visiting www.cardinalxtal.com or by contacting James Magos at jmagos@cardinalxtal.com. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 