| Posted by Jade Po Kellard on 29 June 2009 at 06:00
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ZESTRON, the leading manufacturer of cleaning agents for SMT production, presents the new PCB cleaner VIGON® A 201 at the upcoming NEPCON Shenzhen 2009.
The MPC®-cleaning agent provides excellent cleaning performance in capillary spaces. Therefore flux residues even under low standoff components, such as Micro BGAs, Flip Chips, and 01005 components can be reliably removed. Being used at low concentration VIGON® A 201 offers a wide process window and is especially suitable for removing fluxes from leaded as well as lead-free NoClean solder pastes. Its good compatibility with sensitive metal alloys leading to shiny solder joints after cleaning without any additives being necessary is another main advantage of the product.
The cleaning agent VIGON® A 201 was specially optimized for spray-in-air processes and therefore shows excellent cleaning results even with short contact times. Having an extremely low VOC content the cleaner is also environmentally friendly.
For more information please visit us at NEPCON Shenzhen (Booth #1H22) or have a look at www.zestron.com. |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 