| Posted by Jade Po Kellard on 30 June 2009 at 06:00
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Book your seminar place or table top space contact Tony Gordon info@smartgroup.org
Area array technology has been around for over 10 years but whilst some companies are pushing designs and stretching their process by using the latest array packages many companies are still on the brink of implementing their first BGA design. The LGA/QFN packages are found in many applications but are often new to design and assembly staff. With the conversion of many small outline devices to leadless formats the package popularity will only increase. There are many design issues that directly impact assembly; plastic packages are more prone to cracking due to moisture in a lead-free environment as opposed to tin/lead soldering temperatures.
They also love to float on the surface of solder during reflow due to paste volume and wetting issues. This seminar is the opportunity to talk to and learn form People who are using all of these technologies successfully on a daily basis.
Reliability is a key factor with some of the larger array packages, assembly and the choice of components has a big part to play in the performance and the visual appearance of the solder joints. Lead-free has increased the issues associated with BGA, corner ball cracks, laminate pad cratering, incomplete reflow and package warping are just a few. All LGA/QFN packages suffer from voiding, how does solder mask reduce voiding and how do voids impact on package standoff height and alternately reliability and thermal performance?
The seminar will be divided into three sessions covering design, assembly, rework and inspection using optical and x-ray inspection of solder joint. The seminar will feature speakers with years of practical experience with these packages and the event will be a sell out based on the success of last years QFN and STACK seminars.
Theory session included in this event will cover:
BGA and LGA Design rules for printed board assembly
• LGA/QFN footprint and solder mask layout
• PBGA and Ceramic Ball Grid Array design
• Use of location marks
• Wetting indicators
• Reliability of Tin/Lead and Lead-Free mixtures
• BGA and nickel/gold board reliability
BGA and LGA Assembly processes and impact on yields
• Screen Printing
• Placement inspection
• Convection and vapour phase reflow
• Correct profiling procedures
Rework plus optical and x-ray inspection and process related defects
• Removal procedures for area array packages
• Replacement options for packages
• Optical and x-ray inspection quality indicators
• Process defect and why they occur
Each delegate will receive a free set of SMART Group BGA inspection wall charts and a copy of all the presentation material. Depending on table top exhibitors we hope to provide the opportunity for rework and inspection of board assemblies.
To book your seminar place or table top exhibition space contact Tony Gordon info@smartgroup.org
Tony Gordon
SMART Group
85 Easton Street
High Wycombe
Bucks
HP11 1LT
Tel 01494 465217
Fax 01494 473975
Mob 07860 533426
e-mail info@smartgroup.org
Lead Free Training www.smartgroup.org/pdf/smartlftraining.pdf |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 