| Posted by Jade Po Kellard on 30 June 2009 at 06:00
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KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager - Americas, will host a free Webinar on Wednesday, July 1 at 10:30 a.m. PDT in response to the overwhelming turnout to this Webinar when previously presented. The topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.
Titled “How to Profile BGAs,” the Webinar will last 30 minutes and will highlight ways of successfully profiling BGAs. BGAs are becoming ever more difficult to properly reflow due to a whole host of challenges, such as BGAs relative thermal mass to other components, their relative position to other components on denser populated boards, differences in conductive materials such as ceramics and the tightening of overall reflow specs due to lead-free conversion. All of these new demands leave little room for error, thus the need for high-quality profiles.
During this Webinar, KIC will discuss various techniques for reliability profiling BGAs, such as thermocouple attachment. Also discussed will be some groundbreaking methods of BGA inspection, using the profiling process as one more tool in the arsenal to create a more robust inspection regiment for BGAs.
For more information, or to join the meeting on July 1, visit https://kicthermal.webex.com/kicthermal/j.php?ED=111785987&UID=0. The meeting number for this Webinar is 334 392 363. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 