| Posted by Jade Po Kellard on 02 July 2009 at 06:00
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 Cookson Electronics announces the global launch of its latest ALPHA® brand solder paste - CVP-520. This innovative new product is a lead free, no-clean, zero halogen solder paste that is designed for pin-in-through-hole assembly of temperature sensitive components. For mixed technology applications, this could enable electronic assemblers to reduce or eliminate wave or selective soldering processes.
"Our beta site customers have discovered how much energy can be saved in a traditional SMT line by using our new low melting point alloy," said Mitch Holtzer, Global Product Manager. "In some cases, less expensive substrates and components can be used because CVP-520 can be successfully reflowed when peak reflow temperatures are in the 155 to 190°C range. Components that could not withstand a lead-free reflow thermal excursion can now survive when CVP-520 paste is used.”
ALPHA® CVP-520’s low reflow temperature capability delivers excellent print and reflow process yields for pin-in-through-hole applications. Additionally, it offers excellent fine feature printing on 0.30mm (012 inch) circles at speeds up to 100 mm/second (4 inches/second). CVP-520 provides excellent in-circuit pin test yield and passes IPC, Bellcore and JIS electrical reliability standards.
For more information about the ALPHA® CVP-520, please visit www.alpha.cooksonelectronics.com. |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 
SMT Manager
Posted by: Leuthsana Vorabouth () on 06 July 2009 at 07:00