| Posted by Jade Po Kellard on 03 July 2009 at 06:00
|
 Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, features Young Jin Conveyors for SPI and AOI.
YJ Link’s SPI NG/Good Buffer is designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission, RS-232C interface with SPI, and NG PCB anti-touch verification. This method provides increased line efficiency and requires only minimal space for equipment. Using the SPI NG/Good Buffer, there is no need to filter NG PCBs and SPI operates normally, even during NG PCB verification.
YJ Link’s AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. This system also features a PCB shock-free and noncontact power transmission.
Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch screen operation.
For more information about YJ Link’s SPI and AOI NG Conveyor Systems, visit www.seikausa.com. |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 