June 2009 (Volume 9, Issue 6)

Read the European edition online (or download the PDF).

Read the Americas edition online (or download the PDF).

Editorial
Getting ready for a long, hot summer
Trevor Galbraith

Technology Focus
RoHS war stories
Bev Christian, Research In Motion, and Michael Fry, Intertek Ageus Solutions

Energy measurement: The main metric for high strain rate bond testing of solder balls
Dr. Stephen Clark, Dage Precision Industries

A revolution in wave soldering
Peter Grundy, ITM Consulting

Special Features
Interview—Bill Schreiber, Smart Sonic Stencil Cleaning Systems
From the inside: STI Electronics
NEPCON China sees first green shoots of recovery
SMT/Hybrid/Packaging beats the recession
MYDATA positions itself for strong growth
Case Study: A successful model for PCB fabrication in an ever-changing market

Regular Columns
Copper dissolution—report and process guide
Bob Willis

IC packaging technology retrospective—part 4
Joe Fjelstad

Sobering first quarter—Modest seasonal & cyclical recovery now underway
Walt Custer and Jon Custer-Topai

Other Regular Features
Industry News
New Products
Association News
On Globalsmt.net
International Diary 

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