| Posted by Dr. Stephen Clark on 03 July 2009 at 12:11
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Solder joint integrity may be compromised through mechanical shock, particularity in portable electronics using area array devices with solder balls for interconnections.
The use of lead-free solder in these packages makes them susceptible to brittle fracture failures at the solder ball to pad interface. High strain rate methods are needed to detect these failures and board level drop testing has been the traditional method to assess this type of solder joint reliability. Unfortunately it is time consuming, expensive and the results may be ambiguous. High strain rate bond testing using energy as a quantitative metric is suggested as an economic, rapid, and easy to use method, applicable equally to product design and production monitoring.
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 