Solder joint integrity may be compromised through mechanical shock, particularity in portable electronics using area array devices with solder balls for interconnections.

The use of lead-free solder in these packages makes them susceptible to brittle fracture failures at the solder ball to pad interface. High strain rate methods are needed to detect these failures and board level drop testing has been the traditional method to assess this type of solder joint reliability. Unfortunately it is time consuming, expensive and the results may be ambiguous. High strain rate bond testing using energy as a quantitative metric is suggested as an economic, rapid, and easy to use method, applicable equally to product design and production monitoring.

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Keywords : Solder Ball Interconnection, Brittle Fracture Failure, Bondtesting, Energy Measurement, Board Level Drop Testing, High Strain Rate Bondtesting

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