July 2009 (Volume 9, Issue 7)

Read it online or download the PDF.

Editorial
A strange month
Trevor Galbraith

Technology Focus
Metal-based wafer level packaging
Shari Farrens, Ph.D., SUSS MicroTec

Cost reduction of wafer level packaging by using established materials from non-electronics industries
Giles Humpston, Tessera

Special Features
Interview—Isao Muraoka, Seika Machinery

Case Study: Reducing recall risk down to no more than three PCB panels

Report: Cookson strengthening its position in Central Europe

Regular columns
Practical BGA rework—the simple way forward with POP paste
Bob Willis

Global recovery looking more & more likely
Walt Custer and Jon Custer-Topai

Solder joint reliability prediction for chip components, MELFs, TSOPs, SOTs, etc.
Werner Engelmaier

IC packaging technology retrospective—part 5
Joe Fjelstad

Other Regular Features
Industry News
New Products
Global SMT & Packaging Online
Association News
International Diary

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