9.8 – August 2009

• "Establishing a precision stencil printing process for miniaturized electronics assembly" by Chris Anglin, Indium Corporation
• "Moving AOI beyond the grey world" by Shoich Rashed, Marantz Business Electronics Europe
• "Solder joint reliability: acceleration transforms and acceleration factors" by Werner Engelmaier
  

August 2009 (Volume 9, Issue 8)

Read it online or download the PDF.

Editorial
Don’t put all your eggs in the China basket
Trevor Galbraith

Technology Focus
Establishing a precision stencil printing process for miniaturized electronics assembly
Chris Anglin, Indium Corporation

Moving AOI beyond the grey world
Shoich Rashed, Marantz Business Electronics Europe

Special Features
Tribute to Dr Steven K. Case

Interview—Dan Weitzman,Valor Computerized Systems

A peek into Singapore’s high tech manufacturing marvel

Regular columns
Solder paste test print
Bob Willis

Second half of 2009—off to a better start globally
Walt Custer and Jon Custer-Topai

Solder joint reliability: acceleration transforms and acceleration factors
Werner Engelmaier

IC packaging technology retrospective—part 6
Joe Fjelstad

Other Regular Features
Industry News
New Products
Global SMT & Packaging Online
Association News
International Diary

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