September 2009 (Volume 9, Issue 9)

Read the Europe edition online or download the PDF.

Read the Americas edition online or download the PDF.

Editorial
China on the rise, but patchy picture elsewhere
Trevor Galbraith

Technology Focus
PoP (package on package) and vapor phase technology
Dan Coada, EPIC Technologies

A baseline study of stencil and screen print processes for wafer backside coating
Jeff Schake, DEK USA, Inc.

Special Packaging Section
Imbedded Component/Die Technology: Is it ready for mainstream design applications?
Casey H. Cooper, Mark T. McMeen and Jim D. Raby, STI Electronics, Inc.

IC packaging and interconnection technologies’ 4th dimension challenge
Joseph Fjelstad

Special Features

Interview—Mike Nelson, Etek Europe
IPC Midwest technology preview
SMTA International technology preview

Regular columns

IC packaging technology retrospective—part 7
Joe Fjelstad

Conformal coating defects and solutions
Bob Willis

Fatigue and creep wearout failures in electronics—a historical retrospective
Walt Custer and Jon Custer-Topai

Fatigue & creep wearout in electronics: a historical retrospective
Werner Engelmaier

Other Regular Features
Industry News
New Products
Association News
International Diary

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