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2006 Media Kit PDF Print E-mail

Print Magazines Global SMT & Packaging publishes ten issues of the EU/US editions, and six issue of Global SMT & Packaging China, per year. An exciting array of editorial features are planned including special editions on RFID, Lead Free Technology and Medical Electronics.

Electronic Media The Global SMT & Packaging website will continue to be developed and supported by monthly Newsletters. These News services will be expanded in 2006, with Chinese language versions planned.

Email marketing services to China and Eastern Europe also offer companies a direct route to the desktop of potential customers.

Technical Seminars and Table-Top Exhibitions In 2006 we intend to expand our CEMCEX range of events to include: Hungary, Poland, Russia and Turkey. These highly focused events are an excellent way of exploring new and emerging markets, or supporting existing distributors.

We hope there is something for everyone in the 2006 Media Schedule. We never forget that the relationship between the industry and the press is a working relationship and we look forward to developing this commitment in the coming year.

Download the media kit in PDF format. 

Or contact a Global SMT & Packaging Advertising Rep:

Europe
David Garnsworthy
Tel: +44 (0)1458 833207

United States - East Coast
Ron Friedman
Tel: +1 (860) 523-1105

United States - Mid West
Bob Casey
Tel: +1 (847) 223-5225

United States - West Coast

Liz Richards
Tel: +1 (815) 363 3497

China
Crystal Luo
Tel: +86 (21) 54181366

 

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

 

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff