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Mike Tam shows some of the automotive parts using
pressfit technology
WKK are safety conscious when demonstrating the
MS2 chemical surfactant for solder recovery

Simon Lieuw introduces the new ICON i6 printer

The new tray fed version of the BPM Helix programmer

Abby Tsoi (KAL) congratulates BTU on the launch
of their new
Pyramax 125

Kevin Laphen (Practical
Components) describes the
new range of
AMKOR dummy components

Tom Forsythe and Erik Miller manning the Kyzen booth

Dennis Rutherford explains why Cyberoptics offer
the most reliable and repeatable 3D paste measurement system

Freddie Chan (KIC) announcing
the planned opening
of the new KIC
office in Beijing

Craig Wilson (Kester) outlines some of the new ITW philosophy that will drive Kester's future strategy

Fanny Lee (Europlacer) demonstrates the unique features in
the Xpress placement machine
TYCO unveils their latest press fit system for large backplanes
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Business was booming in Shenzhen last week
at the annual Nepcon South China exhibition with a number of multi-million
dollar orders confirmed.
Alongside the brisk business was a number
of innovative product launches, demonstrating the significance of this event in
the electronics manufacturing calendar.
Leading the rash of new product intros was
a superb new XTF gun that accurately tested for the full spectrum of RoHS
materials plus Beryllium, Selenium and Antemone. Manufactured with an
upgradeable PDA plugged into the front that connects to computers by Bluetooth
or USB, this is the only system on the market using Cobalt 57, which is less
radio-active than other XTF machines and can penetrate materials to a depth of
8-9mm. LeadTracer is marketed in China by WKK Ltd. With a recent Boeing
report claiming that up to 15% of all goods-inwards shipments is contraband,
this is a must-have for all lead-free compliance agencies.
WKK
exhibited another
China first with the introduction of MS2 chemical surfactant,
a solder additive that saves manufacturers up to 40% on their solder costs.
ICON Technologies launched two new printers to complement
their i8 machine. The i6 is very competitively priced, without losing the functionality
that ICON is known
for. Their mainstay i8 printer has been made more user-friendly with the
addition of an automatic board clamp
that handles 300 – 738mm boards, improved software and an ergonomic cover. At
the top of their range, the i8+ comes complete with paste inspection and
tooling. General Manager, Simon Leow said, “ICON offers the best value-led
printers for today’s market. We are responding to market needs by introducing
a
new broader portfolio with improved cost-performance.”
BP Microsystems changed their name to BPM
Microsystems to avoid clashes with the oil giant. At least their prices are
not mirroring those of their
Houston neighbour. One big success they did chalk up was the launch of the
tray version of their popular Helix programmer, making them the first
programming company to offer both stick-fed and tray-fed programmers in a
desktop format. The Helix has a throughput of 800cph and comes with a range of
nozzles to fit most die sizes.
BTU has had
a long success story manufacturing in
China.
Their
Shanghai plant has undergone three expansion
phases. The new model Pyramax 125 was launched at the show. This 10 zone reflow
oven was developed as a joint
venture with their
Massachusetts facility and offers a smaller
footprint and lower nitrogen use with closed loop convection.
Practical Components introduced their unique range of AMKOR POP (Packaging o Package)
dummy components to the
China market on the WKK booth. CEO Kevin Lapin explained that the “AMKOR
dummies are the exact size and weight of the original components.” Through a
special OEM agreement with AMKOR, Practical Components are first to launch all
new packages.
Kyzen
reported that the market for their stencil cleaning, oven cleaning and hi-rel
cleaning materials was huge in the Shenzhen area and they were gaining market
share fast.
Aqueous Technologies launched an ultrasonic stencil washer that offered 1000 watts of
cleaning energy in a closed-loop system. The zero-discharge machine filtered
the used cleaning fluids through a unique micron and carbon filter, then
deionised the water for reuse in the machine.
Cyberoptics
demonstrated their SE300 Ultra solder paste inspector. With a 25 second cycle
time and 100% 3D inspection, the SE300 claims to be the most accurate and
repeatable in the market.
VJ Electronix have improved the heat transfer and distribution on the rework
table of their Summit 1800 pick ‘n place thermal processing system. They have
also fitted a new solder removal system, programmable X Y location finder for
very small components and upgrade software with SPC capabilities.
KIC are
enjoying record sales of their 24/7 oven profiling software and announced the
opening of an additional office in
Beijing to service
the growing demand in
China for their products.
Finetech exhibited their Fineplacer CRS10 rework station which can accommodate all types of advanced rework (SMT, BGA, small passive, flip chip, lead-free, etc.). Better than 10 µm placement accuracy allows for rework of applications on high density packaged boards. The system provides full functionality to handle the complete rework process and supports automated component placement and lift-off.
Essemtec’s
goal of becoming the world leader for small- to medium-sized production
equipment is on course with an installed base of over 4,000 machines worldwide.
The new
SMT
Tower was announced at the show - an environmentally controlled storage
cabinet capable of storing up to 4,000 components.
Kester are
opening a new office in Guandong to provide local sales and support. Regional
Director, Craig Wilson said the uptake of lead-free solders in
China was
around the 50% range, which he expected to extend to as much as 90% by the end
of the year.
Polyonics
opened a new office directly across the road from the Nepcon Shenzhen
exhibition to distribute their range of lead-free compatible labels.
Europlacer
claimed that their Xpress 25T placement machine offered the greatest
flexibility in the market and was futureproof. Using their “Integrated
Intelligence”, intelligent feeders and the 12 position Tornado™ turret head,
the machine can be easily reconfigured for any placement application. The
turret head does not do multiple picking and can therefore perform as fast with
one nozzle as it can with 12.
Assembleon
launched the AX501 in Shenzhen. The AX501 can handle virtually any component
type from 0105’s up to 45mm x 45mm. The system uses laser alignment or an optional vision system. Using the Hover
Davis die feeder, it can place up to 30,000 cph, offering die placement at SMT
speeds. The AX series offers dispensing, separate fluxing and AOI with easy to
gather data feeding corrective instructions back into a closed loop placement
system.
TYCO
demonstrated the AEP12T pin insertion machine, which can insert up to 22 large
connectors into large backplanes. The system uses the patented “Action Pins” from
TYCO-AMP and the tooling can be changed into any configuration as required.
This solderless system uses automatic loaders and servomotors to insert the
pins at the precise pressure required.
When questioned about the FCM system, CEO
Leon Husson said, “There has definitely been some perception issues with our
FCM concept, but I firmly believe that our parallel placement offers the
fastest changeover time in the business.”
With record visitor numbers to match the
record sales on the floor, Nepcon Shenzhen confirmed its place as one of this
year’s most dynamic shows.
With record visitor numbers to match the record sales on the floor, Nepcon Shenzhen confirmed its place as one of this year’s most dynamic shows.
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