| Posted by Global SMT & Packaging on 12 September 2006 at 09:50
|
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Issue 6.8 / September 2006
– Editorial –
The smart money is moving east
Trevor Galbraith
– Technology Focus –
How to clean lead–free materials
Thomas M. Forsythe
Atmospheric plasma – A new surface treatment technology for
cleaning PCBs
Rory A. Wolf
Alternative technologies for lead–free defluxing
Michael T. Konrad
Rework system–to–system performance characterization
Al Cabral
– Special Features –
Assembly Technology Expo 2006 Preview
Derek Gaston Interview – Europlacer
– Regular Columns –
Microelectronic miniaturization…. Past, present and future (North American edition)
Joe Fjelstad
PCB solderability assessment – The industry standard (European edition)
Bob Willis
Fall ‘busy season’ and increased demand
Jon and Walt Custer
Challenges in lead–free soldering (North American edition)
Dongkai Shangguan
How to specify reliable PCBs for lead–free solder assembly
Werner Engelmaier
– Other Regular Features –
Industry News
New Products
Association News
International Diary
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued "recovery" in 2010. 