2009 will certainly be remembered as a very difficult year for the global electronics industry. Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
Here is some information on the current and forecasted world economic climate, plus the status and outlook for the world electronics “food chain.”
Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will
strengthen Techcon Systems in these challenging times and beyond.
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI.
Inevitably all stencils need to be cleaned to remove solder
paste residues from the surface of the foil and from the apertures to prevent
it drying and giving missed/incomplete prints.