No comment posted mXcomment 1.0.9 © 2007-2010 - visualclinic.fr License Creative Commons - Some rights reserved |
Featured Interview
Small Matters
Lead-Free Matters
Global Business
Industry BlogsKeep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff |
||||||||||||||||||||||||||||



Dave Bernard (Dage) and I have been considering a possible method of measuring the standoff height of PoP devices after soldering and the possible detection of any variation in the assembly process. Obviously you still use existing optical criteria and with possible enhancements planned in IPC 610; the document may become more useful to staff faced with inspection of area array devices.





(0 vote)
