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Dave Bernard (Dage) and I have been considering a possible method of measuring the standoff height of PoP devices after soldering and the possible detection of any variation in the assembly process. Obviously you still use existing optical criteria and with possible enhancements planned in IPC 610; the document may become more useful to staff faced with inspection of area array devices.
(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued "recovery" in 2010. 