| Posted by Global SMT & Packaging on 15 September 2006 at 08:13
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Planned every two years in a different European country for the past 30 years, the EMPC conference will follow the ISHM/IMAPS tradition of industrial/scientific programme on microelectronics, materials, manufacturing and industrialisation. It will, however, be expanded from traditional microelectronics packaging to include latest advances in related fields like sensors, nanotechnology and real System in Package applications and brings together specialists from industry and academia. Special attention is also given to the business related issues of our industry. For the second time in Europe, a special session by the IMAPS Global Business Council (GBC) is introduced.
Call for abstracts is open till October 31, 2006. Here you have your chance to show your results and discuss them with world leaders.
The conference and exhibition takes you to the hi-tech business, industry and development capital of Northern Scandinavia. Oulu is the technology base for large international corporations like Nokia and a large number of small and medium sized hi-tech enterprises. For microelectronics and packaging, University of Oulu (16 000 students) and VTT in Oulu are globally well known research and development partners. Technopolis, housing some 550 companies, is the first and the largest science park in the Nordic Countries and the only listed company of this kind in the world. Together with 13 other competence centres (or Technology Parks) in the surrounding Northern Finland they form a unique, active Multipolis Network, the world’s largest technology conglomeration. The advanced education and research provides experts for most demanding R&D and business tasks in areas like telecommunication, optoelectronics, biotechnology and pulp and paper and metal industry. Fruitful interactions are granted through local tutorials, exhibitions, speakers and even company visits.
Oulu is well connected through Helsinki, Finland (20 daily flights a´ 50 min), and Stockholm, Sweden. The unique panOulu public WLAN access network covers all conference and hotel areas free of charge! The conference participants will be offered active interaction with this hitech hub both in the programme and on a private basis.
Don’t forget to experience the Midnight Sun! IMAPS Nordic will bring its well known family atmosphere to this big event.
EMPC 2007 takes place in Oulu, Finland, June 17-20, 2007. www.empc2007.org
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 