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NPL seeks interested partners for three new formulation projects PDF Print E-mail
 

Posted by Global SMT & Packaging on 18 September 2006 at 10:05

At the invitation of DTI, National Physical Laboratory is in the process of formulating three new projects for which it is seeking partners:

  • “Sensor for wireless measurement of coating performance” - the specification and generation of an integrated sensor and control system to monitor coating performance, particularly in hostile and remote conditions such as automotive and aerospace environments, and power applications. The system, based on previous NPL work, will indicate the remaining lifetime of the coating.
  • “Meeting the interconnect challenge of Moore’s Law” – increasing device complexity and design constraints mean that interconnect current densities are increasing rapidly (>104 Acm-2), which in turn can cause void formation, high resistance and poor fatigue performance. The project will obtain a better understanding of how the voids are generated, and develop barrier systems that allow the interconnect to carry higher current densities.
  • “Sustainable electronic substrates for 2015” – as industry aims to recycle 10% of pcb base materials by 2015, assembly must incorporate more environmentally friendly materials and new end-of-life strategies. The performance of alternative pcb base materials (including biodegradable) will be investigated, and disassembly methods using dissolvable materials evaluated. The study will help industry devise a coherent strategy for equipment end-of-life disposal, re-use and recycling.

Interest in participation in the formulation process, or in the projects themselves, is welcomed, as are any comments on their contents.      

Contact Chris Hunt - Tel: 020 8943 7027, Fax: 020 8614 0428, E-mail: chris.hunt@npl.co.uk
 

   
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Keywords : National Physical Laboratory, NPL, DTI, wireless measurement, coating performance, interconnect, Moore's Law, sustainable electronic substrates


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