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2007 Media Kit PDF Print E-mail

Print Magazines Global SMT & Packaging publishes twelve issues of the EU/US editions, and six issue of Global SMT & Packaging China, per year. An exciting array of editorial features are planned including special editions on RFID, Lead Free Technology and Medical Electronics.

Electronic Media The Global SMT & Packaging website will continue to be developed and supported by twice-monthly newsletters. These news services are being expanded, with regional Chinese, Hungarian and Japanese Global SMT & Packaging-branded website.

Email marketing services to China and Eastern Europe also offer companies a direct route to the desktop of potential customers.

Video Show Reports In 2007, we bring you video footage from the major trade shows, as well as video interviews and product demonstrations, straight from the show floor.

We hope there is something for everyone in the 2007 Media Schedule. We never forget that the relationship between the industry and the press is a working relationship and we look forward to developing this commitment in the coming year.

Download the complete media kit: with prices in USD | with prices in GBP & EUR

Download just the print magazine schedule, specs & pricing: prices in USD | prices in GBP & EUR

Download just the digital (web & e-newsletter) specs & pricing: prices in USD | prices in GBP & EUR

Or contact a Global SMT & Packaging Advertising Rep:

Europe
Andy Kellard
Tel: + 44 1202 388997

United States - East Coast
Ron Friedman
Tel: +1 (860) 523-1105

United States - Mid West
Bob Casey
Tel: +1 (847) 223-5225

United States - West Coast

Liz Richards
Tel: +1 (815) 363 3497

China
Crystal Luo
Tel: +86 (21) 54181366

 

 

Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

 

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff