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Greetings!
As I write this, we are preparing for a number of major shows
in the US and Europe. Many people are saying that there are too many
shows, serving too small an audience. If you are not convinced, take
a look at our schedule over the next ten weeks!
First up is IPC MidWest, the new industry show that resulted from the fallout
of SMTA with the new owners of ATE, to be held in Schaumburg,
Illinois, 26-28 September. SMTAI debuts in Orlando, Florida, 8-11 October.
Mexitronica runs in Guadalajara 23-25 October. Nepcon East
is October 30-31st in Boston. IMAPS, in San Jose, California, runs 12-15
November, and finally Productronica takes place 13-16 November in Munich,
Germany.
Trevor Galbraith
Editor-in-Chief
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EFD Soldering Products
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| Download
the August Issue (7.8) |
The September issue of Global SMT & Packaging introduces a ground-breaking
new technology from Verdant Electronics, iNEMI's exploration of process optimization
for wave soldering operations, x-ray considerations for the production floor,
package-on-package (PoP) process development and reliability evaluation and
more. Download
now.
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IPC Midwest: September
26-28, Shaumburg, Illinois, USA
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Obtaining and
controlling reflow oven cooling rates
by Fred Dimock, Rob DiMatteo
The implementation of lead free solder has forced solder suppliers,
component manufacturers, board providers, reflow process engineers
and standards groups to look at all aspects of the reflow profile.
One area that is receiving increased attention is the cooling rate.
Some studies show that the shear strength of tin-silver-copper (SAC)
solder is slightly lower than eutectic lead solder and that smaller
grains obtained by faster cooling can regain some of the strength.
On the other hand, large BGAs advocate slower cooling rates to minimize
shearing. Read
the full article...
This article was taken from Global SMT & Packaging Vol. 7 No.
8 - August 2008
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Don't
miss this totally electronics focused event
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| Walt & Jon Custer's Market Update |
The
bottom is behind us; positive vibes for 2H’07
The autumn busy season is around the corner, and it appears that we are
also now in the early recovery phase of the next electronics business cycle.
In the second quarter of 2007, a composite of 61 large, publicly traded,
multinational OEMs reported a 6% sales increase versus 2Q’06 with
net income up 115%. Although electronic component and material
suppliers experienced an early 2007 downward correction, their end-customers
as a group did fine. As 2Q’07 OEM sales growth continued, the ratio
of inventories/sales declined, suggesting that the OEM and EMS
inflated raw material, WIP and finished goods inventories have declined
to better levels. This should unleash more component purchases as we head
into the traditionally stronger pre-holiday season this autumn. Read
the full column...
This column was taken from Global SMT & Packaging Vol. 7, No.
9 – September 2007
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Optical silicones
for use in harsh operating environments
by Bill Riegler, Stephen Bruner and Rob Thomaier
The optics industry widely uses silicones for various fiber-optic,
cable potting applications and light-emitting diode protection.
Optics manufacturers know traditional silicone elastomers, gels,
thixotropic gels and fluids not only perform extremely well in
high-temperature applications but offer refractive index matching
so that silicones can transmit light with admirable efficiency.
However, because environmental conditions may affect a material’s
performance over time, one must also consider the conditions
in which the device operates to ensure long-term reliability. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 8 - August 2008
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| Phoenix
x-ray: X-ray computed tomography |
Faster Quality
Control with X-ray Computed Tomography
X-ray inspection is a quality control tool that not only leaves the
product intact but is also considerably faster than destructive testing.
But some of today's inspection challenges will require more than conventional
X-ray inspection, especially when inspecting microassemblies with complex
three-dimensional structures. True 3D x-ray computed tomography can
greatly benefit quality inspection: Time-saving and cost effective,
CT systems like the phoenix|x-ray v|tome|x can create a 3D model in
less than an hour, which can then be virtually sectioned. Find out
how 3D x-ray can benefit your company's bottom line... Read
more...
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RMD – Jack
Paster Interview
RMD manufacture one of a number of handheld XRF machines designed
to identify lead in printed circuit assemblies. However, their LeadTracer™ XRF
gun has a number of key features that differentiates it from its competitors,
providing a more comprehensive and accurate report on a wide range
of metals. Trevor Galbraith interviewed CEO, Jack Paster to find out
more. Read
more...
This article was taken from Global SMT & Packaging Vol. 7 No.
8 - August 2008
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Beating the
chip counterfeiters
by Keith Bryant
As the components needed for today’s electronic products
increase in complexity, their cost rises, with some specialist
chips costing many hundreds of dollars each. With the packages
all looking the same, and the only way to optically distinguish
individual devices being through their printed information, these,
and many other ICs, are extremely attractive to the counterfeiter.
Sadly, there will always be people ready to make a fast buck
at the expense of someone else. If you add to this the practical
realities of supply shortages, new product introduction (NPI)
and the need for a faster time to market, then it further creates
an opportunity for the counterfeiters, as higher prices are commanded
for lower cost items which become scarce and/or are normally
on long lead times. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 8 - August 2008
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| SEMICON
Europa early bird discount |
SEMICON Europa
9-11 October 2007
Early-bird price discount – Register
before 14 Sept.
Over 25 technical and business programs focused on Test, Assembly
and Advanced Packaging, MEMS/MST, Semiconductor, and Photovoltaic.
Meet over 800 exhibiting companies (including over 100 new exhibitors),
see the technologies, and discover the trends mobilizing European innovations.
www.semiconeuropa.org
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Invitation
to 3D IC Technology Symposium
On October 4th, 2007 a one-day Technology Symposium on 3D IC Integration
will be held at the High Tech Campus in Eindhoven, The Netherlands, as part
of the second EMC 3D European Roadshow.
Balver
Zinn co-sponsors SMTA Hong Kong chapter’s annual reception
The reception was held to honor the SMTA South China conference attendees,
speakers and presenters and was held in conjunction with the Nepcon South
China exhibition.
Verdant
Electronics announces date for Occam Conference
On Tuesday, October 16th, a diverse group of industry experts and technology
leaders will present their views on the Occam process based on their own
unique perspectives.
Luminary
Micro Stellaris® microcontroller products now available at Digi-Key
The availability of these products is in keeping with the signing of a global
distribution agreement which was announced in June.
Palomar
Technologies presents methods to improve wire bonding & ball bumping
geometries
Palomar Technologies will present “Geometry and Bond Improvements
for Wire Ball Bonding and Ball Bumping” at the International Wafer-Level
Packaging Conference on September 19, 2007.
SMT Resource Group expands
SMT Resource Group LLC (SMTR) has just expanded their facility in NC to
increase their machine restoration capability.
More Industry News...
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RVSI
introduces the WS-3800 Xpress wafer inspection system
Surface defect inspection speeds reach 115 wafers per hour.
'3 Musketeers' of SMT assembly revealed at Manncorp web site
Three pick & place machines, dubbed “The Three Musketeers of SMT
assembly” by Manncorp’s CEO Henry Mann, offer head-mounted cameras
and advanced Cognex® processing for non-contact on-the-fly vision placement
of 0201 chips to 16 x 14mm SMDs and fine-pitch QFPs.
New
200-400 MHz VCO from Crystek Corporation
Crystek's CVCO55CW-0200-0400 VCO operates from 200 MHz to 400 MHz with a control
voltage range of 0V~5V.
More New Products...
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Forward to
a colleague
Global SMT & Packaging magazine
email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com
Trafalgar Publications Limited
65 High Street
Glastonbury, Somerset
BA6 9DS United Kingdom
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September 18, 2007
Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Trevor Galbraith at editor@globalsmt.net.
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