Solder pastes are key materials in surface mount technology (SMT) for assembly
of printed circuit boards (PCBs). Introduction of lead-free has placed new
demands on materials and processes in SMT, requiring materials and process
engineers to adopt to lead free whilst ensuring process yields stay at the
highest possible levels. Read
the full article...
This article appeared in Global SMT & Packaging 7.12 December
2007.
If you are repairing land grid array (LGA) or area array devices, should
you print the circuit board or the device terminations? Which is easier
and more repeatable? It depends on your own skills. Which one works?
They both do. Read
more...
This column appeared in Global SMT & Packaging 7.12 December
2007.
The figure at left shows an example of excessive paste push out during
through hole assembly which will prevent any satisfactory joints being
formed. Read
more...
Do you have a technical solution
for the industry?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query,
contact Trevor Galbraith at editor@globalsmt.net.
Manncorp’s
CR-6000 lead-free reflow delivers large oven capability in small footprint
