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Breaking News


Henkel acquires Abelstik and Emerson & Cumming for €3.8 billion
On Thursday, April 3, Henkel announced the acquisition of Abelstik and Emerson & Cuming for €3.8 billion, cash and debt free.

IPC returning to Vegas for 2009 conference & exhibition
IPC — Association Connecting Electronics Industries® has announced that IPC APEX EXPO™ will return to the Mandalay Bay Resort & Convention Center in Las Vegas next year, March 29–April 2, 2009.

iNEMI launches new collaborative efforts
Lead-free alloys and reliability, boundary scan, and solder paste deposition are the focus of new projects.

Manncorp ‘Insta-Lease’ offers site browsers immediate lease quotes
Realizing that the current economic downturn could impact sales, Manncorp has introduced an equipment leasing program that is instantly accessible online.

ZESTRON launches new website
ZESTRON, manufacturer of cleaning solutions for the electronics industry, has redesigned its website and added specific customer-friendly features.

Inovaxe appoints REStronics as its manufacturers’ representative for much of the United States
Inovaxe Corp. has appointed REStronics Co. Inc. as its distributor for numerous areas throughout the United States.

More Industry News...
 

Featured Article

Lead free HASL
T. Scimeca, G. Sikorcin, and T. Lentz

Featured Article

The solder surface produced on bare printed circuit boards by hot air solder leveling (HASL) has been used extensively as a solderable finish for many years. The recent conversion to lead free solder in the electronics industry has led many people to predict the eventual demise of this process. The purpose of this paper is to report that lead free HASL or LF HASL is not only seen as a way of continuing to use the HASL process in the lead free era but also to give the reader a chance to reconsider this reliable surface finish. Read more...

Featured Article

Featured Column

Seasonal downturn ending, but global economy remains weak
Walt Custer & John Custer-Topai

Walt Custer

Electronic equipment growth has slowed worldwide—both due to normal post-holiday seasonality and a softer economy. This ‘cooling’ is most pronounced in SE Asia (Chart 1) where Taiwan/China OEM three-month shipment growth (vs. same three months of the prior year) has declined from +35% in October to +20% in February. Twenty perfect growth is still an impressive number—but tamer than 2007. SE Asia’s seasonal downturn probably bottomed in February (Chart 2) as the post-holiday slowdown coupled with Lunar New Year plant shutdowns and heavy snows in China combined to limit production. In spite of weak economic conditions, Taiwan/China electronic equipment output should rebound in March. Read more...

2008 Global Technology Awards

2008 Global Technology Awards: New categories added

The Global Technology Awards recognize the very best new innovations in the printed circuit assembly and packaging industries and invites entries from all equipment, materials and EMS companies of all sizes.

This year, four new categories have been added: ID systems, placement equipment - high volume, placement equipment - low/medium volume, and selective soldering. For a full list of categories and more information on the awards, visit http://awards.globalsmt.net

 New Products Spotlight

MYDATA introduces the next generation of pick and place machines
The MY100Series is a completely new placement machine platform which is pushing the limits of SMT technology.

New Vapour Phase rework tool
R&D Technical Services unveiled the industry’s first vapour phase rework tool.

New lead-free paste for Cobar improves reflow and printing performance
Cobar BV has introduced XF3, a lead-free solder paste developed to accommodate extended reflow profiles without the use of nitrogen.

Turn-Key SMT line increases productivity per square foot
Delivers 63,000 cph in just 31 feet.

Dage 4000HS high-speed bondtester complies with new JEDEC standards
Dage Precision Industries' 4000HS high-speed bondtester is the first such test instrument to fully comply with the recently published JEDEC standards for high-speed bondtesting.

FAB Notes recommendations for RoHS-compliant lead-free-capable PCBs
How do YOU assure your PCBs survive the high lead-free soldering temperatures?

More Products News...

Do you have a technical solution for the industry?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.

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