Watch the latest video newscast


Download the
April 2008
print magazine

Henkel closes acquisition of National Starch businesses
Adhesives business significantly strengthened.

Sovtest ATE presents Global SMT and Packaging magazine to the Russian market
The largest Russian exhibition of electronic components and technological equipment, ExpoElectronica, will take place from April 15 to 18 in CrocusExpo in Moscow.

Inovar Inc. hires director of quality
Contract electronics manufacturing Inovar Inc., an inthinc company, announces the hiring of Rick Gour as director of quality assurance.

Etek-Europe appoints service director
Etek-Europe Ltd is pleased to announce Jim Anderson appointed as service director.

IPC returning to Vegas for 2009 conference & exhibition
IPC — Association Connecting Electronics Industries® has announced that IPC APEX EXPO™ will return to the Mandalay Bay Resort & Convention Center in Las Vegas next year, March 29–April 2, 2009.

More Industry News...
 

Process requirements for high density
SMD placement
Sjef van Gastel

As the drive towards assembly miniaturization continues and surface mount technology matures, components are becoming ever smaller and thinner. Despite considerable skepticism when 0201 devices were first introduced, these devices are now commonly used for high density board assembly. Now it is 01005 components’ turn to enter production. Read more...

A brief history of embedded device technology
Joe Fjelstad

Electronics manufacturing technology has evolved slowly since its beginnings. New concepts have risen to prominence and faded into obscurity only to rise again as successive generations of electronic manufacturing engineers take the helm of manufacturing technology. One of the more interesting areas of electronic design and manufacture has been in the area of embedded device technologies. Read more...

2008 Global Technology Awards: entry deadline May 31st

The Global Technology Awards recognize the very best new innovations in the printed circuit assembly and packaging industries and invites entries from all equipment, materials and EMS companies of all sizes.

This year, four new categories have been added: ID systems, placement equipment - high volume, placement equipment - low/medium volume, and selective soldering. For a full list of categories and more information on the awards, visit http://awards.globalsmt.net

New lead-free paste for Cobar improves reflow and printing performance
Cobar BV has introduced XF3, a lead-free solder paste developed to accommodate extended reflow profiles without the use of nitrogen.

New Vapour Phase rework tool
R&D Technical Services unveiled the industry’s first vapour phase rework tool.

More Products News...

Forward this newsletter to a colleague

Global SMT & Packaging magazine
email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.globalsmt.net

Trafalgar Publications Limited
8 Talbot Hill Road
Bournemouth
Dorset BH9 2JT
United Kingdom

Stop receiving Global SMT & Packaging digital content

Editor-in-Chief
Trevor Galbraith
Tel: +44 020 7871 7305 (EU)
Tel: +1 239 567 9736 (US)

China Regional Editor
Lu Shuzhen
Tel: +86 (351) 652 3813

Managing Editor
Heather Lackey
Tel: +1 (828) 231 9434

Digital Advertising
Sandy Daneau
sdaneau@globalsmt.net
Tel: +1 (603) 617-4939

Print & Video Advertising

North America
Lino D'Andreti
ldandreti@globalsmt.net
Tel: +1 (603) 580-5549

Europe
Andy Kellard
akellard@globalsmt.net
Tel: +44 (0)1458 833207

Asia/Pacific
Amanda Tan
atan@globalsmt.net
Tel: +852 (6339) 6969