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April 2008
print magazine

White papers of Siplace technology experts now available for downloading
The Siplace team was represented at this year's APEX by no less than three high-level technology experts, whose presentations can now be downloaded from the Siplace website.

VJ Electronix to host upcoming SMTA meeting
VJ Electronix will host an open house and the SMTA Boston Chapter meeting at its Littleton facility from 5:30-9 p.m. on Tuesday, May 20, 2008.

Soldertec Global offers new ‘same day’ x-ray inspection service
Soldertec Global has launched a new ‘inspection while you wait’ service using the Dage XiDAT 7600 x-ray inspection system.

More Industry News...
 

BGA & stack packages - making dummy parts
Bob Willis

Ball Grid Array BGAs are a widely used technology in a vast range of products, including consumer, telecommunications and office-based systems. As an area array device, it provides high packing density with a relatively easy introduction cycle. Over the last couple of years, engineers have started to experiment and in some cases implement stack packages, what is often called package on package, or POP. Read more...

 

2008 Global Technology Awards: entry deadline May 31st

The Global Technology Awards recognize the very best new innovations in the printed circuit assembly and packaging industries and invites entries from all equipment, materials and EMS companies of all sizes.

This year, five new categories have been added: flux, ID systems, placement equipment - high volume, placement equipment - low/medium volume, and selective soldering. For a full list of categories and more information on the awards, visit http://awards.globalsmt.net

YESTech's M1m AOI system for advanced packaging & microelectronics applications
The M1™ AOI system has been developed with special design enhancements to address the unique inspection challenges presented by advanced packaging, complex wire bonding, epoxy splash and ever shrinking component sizes.

Asymtek Spectrum S-920N: scalable dispensing solutions for microelectronics packaging
The Spectrum S-920N features technologically advanced and integrated software and hardware control for increased throughput, accuracy and productivity.

Breakthrough epoxy flux technology from Henkel
New epoxy flux technology offers cost-effective single material solution for advanced package configurations.

More Products News...

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