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February 2008
print magazine

Sanmina-SCI to sell off personal computing business
Sanmina-SCI Corporation has signed a definitive agreement with Foxteq Holdings Inc., a member of Foxconn Technology Group, for the sale of certain assets of its personal computing business and associated logistics services located in Hungary, Mexico and the United States.

Flextronics bringing additional production to Hungary
It is expected that the increased production will add several hundred jobs.

Indium presents award to Zen Voce
Indium Corporation's Semiconductor Packaging Materials team presented its Equipment Partner of the Year Award to Zen Voce.

Asymtek signs new distributor agreements with AMB Technic and NORANA
These agreements extend Asymtek's sales, service and support in Poland and Turkey.

MEPTEC finalizes program for 4th Thermal Management Symposium
“The Heat Is On: Thermal Technology Solutions for Advanced Products”  will be held on February 28, 2008 at the Wyndham Hotel, San Jose, CA.

Speedline Technologies purchases Koh Young solder paste inspection system
Speedline Technologies has chosen the Koh Young KY-3020T solder paste inspection system for use in their laboratory and manufacturing quality control operations.

More Industry News...

 

No sugar-coated forecasts, just the facts
Walt Custer and Jon Custer-Topai

Let’s call it like it is. A likely recession in the USA coupled with the normal global seasonal winter/spring slowdown in the consumer electronics sector suggests that our industry will face ‘tough times’ at least until early summer. Read more...

This column appeared in Global SMT & Packaging 8.2 - February 2008.

Wire bonding process for bonding over active circuits and low K materials
Joe Fjelstad

In the process of designing, manufacturing and assembling semiconductor chips, there has been a long standing and well established convention that wire bond pads are placed at the periphery of the die to make the wire bonding process easier. Read more...

This column appeared in Global SMT & Packaging 8.1 - January 2008.

Price reductions announced on lead-free & regular solder pastes
Extensive across-the-board price reductions on Manncorp's entire line of lead-free and leaded solder pastes are now in effect.

Agilent Technologies boundary scan-VTEP hybrid minimizes obstacles to in-circuit test
Agilent Technologies Inc. will offer in-circuit test (ICT) users an innovative way to test their printed circuit board assemblies (PCBAs) in a limited access environment.

PROMATION releases PRO 1812 mini laser marker
PROMATION has added a new mini laser marker to its line of marking and engraving products.

More Products News...

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