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June 2008
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Process and assembly methods for increased yield of PoP devices
Brian Toleno, Ph.D., and Dan Maslyk, Henkel

Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the marketplace in the past few years is the package on package (PoP) device. While the designer is limited in what functionality can be ‘stacked,’ since these come packaged together in a single unit, stacking packages can offer significant advantages from a design standpoint; as long as the pad designs are compatible, different device types can be stacked for more versatility in the design and the assembly. Assembling these devices on a standard SMT line, however, can present challenges. Read more...

Challenging times ahead...
Component orders may be exceeding end market demand
Walt Custer and Jon Custer-Topai, Custer Consulting

Regional growth of electronic equipment, semiconductors and printed circuit boards provide timely insight into business conditions in the key electronic centers of the world. Chart 1 shows the 3-month growth of electronic equipment shipments by area. Note Taiwan/China’s large growth-decline (from +36.7% in October’07 to +14.7% in April’08). 14.7% growth is not bad, but for Taiwan & China it is the lowest level since early 2002! Read more...

National Electronics Week videos and round-up

Videos from the show floor, a report from our own Andy Kellard, and the PDF downloads of the popular Show Floor Daily that was handed out to show visitors are all available in our National Electronics Week Show Central area.

Sonoscan Launches HiRes Generation THRU-Scan™
HiRes Generation THRU-Scan™ significantly enhances through-transmission imaging with Sonoscan’s C-SAM® line of acoustic microscopes.

Blue Thunder Introduces Black ESD Conscious Nitrile Glove
Carbon infused and ESD safe, the nitrile glove is a plug-in alternative to the standard blue nitrile gloves found on production floors

Practical Components Now Supplies the Latest FusionQuad™
(VQFP / HVF-PQFP) Dummy Component
FusionQuad™ not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.

More Products News...

Dynasil Completes $20 Million Acquisition of RMD Instruments
Former RMD owners Dr. Gerald Entine and Mr. Jack Paster are now major Dynasil shareholders and will stay with the company.

Dage’s Hal Hendrickson elected to SMTA Board of Directors
Hal has been an active member of SMTA since 1991 and has been actively involved in the electronics industry since 1974.

Henkel & Leading Shanghai-Region Academia form
Joint Electronics Research & Failure Analysis Center
The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China Headquarters in Shanghai, China.

Mirae Announces PPM as USA Distributor
The company specializes in through-hole insertion equipment and surface mount placement machines.

Kyzen Participates in Successful SMTA Penang Chapter Meeting
The meeting was held on 19 June at the Cititel Hotel in Penang and hosted more than 60 attendees from over 20 different companies.

Digi-Key Corporation and FTDI Announce
Global Distribution Agreement
Digi-Key Corporation and Future Technology Devices International Limited (FTDI) announced today that the companies have signed a global distribution agreement.

BPM Appoints Distributor for Turkey
Esman engineers train customers’ engineers and teach them the operation, process and maintenance of the machines.

P.D. Circuits Updates Web Site—
Easy-to-Navigate and Information-Rich Resource
P.D. Circuits announces that it recently updated its Web site to make it more informative and user friendly.

More Industry News...
 

Inside the June 2008 issue of Global SMT & Packaging magazine:

• "Process and assembly methods for increased yield of PoP devices" by Brian Toleno, Ph.D., and Dan Maslyk
• "Suitable choices for lead-free hand soldering" by Shubo Gao and David M. Jacobson
• "Pushing the barriers of wafer level device integration" by Gordon Christison
• Albert Bokma, interview—Assembléon
• Case Study: Are two heads really better than one?
• Inovar factory expansion – an American success story
• "Are we there yet? The ongoing journey to co-design of chip, package and substrate" by Joe Fjelstad (North America edition)
• "Ball grid array & lead-free assembly defects, part 2" by Bob Willis (Europe edition)
• "First quarter 12% global end market growth slowdown but no disaster on horizon" by Walt Custer and Jon Custer-Topai
• "Inadequate peak reflow temperatures" by Werner Engelmaier

Download issue 8.6 - June 2008 today.

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