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Video News
RMD Acquired by Dynasil
Lacroix Acquires PrehTronics
St. Pete Offers Tax Incentives to Keep Jabil
Novastar and Valor Appoint CEOs
Molex Acquires Aflextech
Daewoo to Build New Polish Plant
Global SMT& Packaging
E-mail: news@globalsmt.net
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Editorial Staff
Circulation and Subscriptions
Tel: +44 (0)1458 832137
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Pushing the barriers of wafer level device integration
Gordon Christison, Reel Service Ltd, Glenrothes, Scotland
Techsearch has predicted a compound annual growth rate of more than 24% for wafer-level packages between 2005 and 2010. Contract electronics manufacturers and original design manufacturers face a range of handling problems when using these small silicon devices in assemblies. Traditional solutions to these problems often mean the addition of specialized equipment, such as die bonders, but there are clear operational, quality and financial advantages to being able to utilize standard PCB placement platforms for assembly. While many of today’s machines provide the capability to place and inspect WLPs, presenting these devices to feeders can be a challenge. Read
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Are we there yet?
The ongoing journey to co-design of chip, package and substrate
Joe Fjelstad
The demand placed on electronic product developers to create a continuous flow of new products that offer performance gains with price reductions for each new generation is enormous. Miss your time to market window and you could well be dead. And yet, to their credit, most have yet to wither away from the unforgiving challenge, even though everything must line up exactly right for them to continue to pull of their special from of magic. Read
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Specialty Coating Systems sold
Specialty Coating Systems, Inc. (SCS) has been acquired by Berwind Corporation (Philadelphia, Pennsylvania).
SMTA offering SMT processes and Six Sigma Certification at SMTA International 2008
The program will be held in Orlando, FL at Disney's Coronado Springs Resort and Convention Center.
Indium Corporation Receives Quality Award
Headquartered in Dallas, TX, with facilities in North America, Asia, and Europe, the company has achieved the Quality Awards of QS-9000, ISO-9001:2000, TS16949:2002 and ISO 14001 certifications.
BPM Appoints Distributor for Eastern Europe
An essential part of Etek Europe Ltd.’s philosophy is customer care and this has led the company to increase its engineering and refurbishment department.
MIRTEC Reports 81% Growth for First Half of Fiscal 2008
MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.
Seasoned Manufacturing Veteran Tim Kardish Joins APS Novastar
New CEO focused on launching growth initiatives at the company
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Industry News...
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| Global SMT & Packaging magazine |
Inside the July 2008 issue of Global SMT & Packaging magazine:
- "Understanding hidden reactions and the importance of profile in reflow soldering, part 1" by Dr. S. Manian Ramkumar, Anand Kannabiran, Aarthi Baskaran, Dr. Viswam Puligandla, Bjorn Dahle
- "PCB production & test: Tips from pros on lead-free processes, part 1—issues in hot air solder levelling (HASL)" by Thomas Berger
- Case Study: Solder dross recycling: Tried, tested and proven at Kimball Electronics
- Case Study: Electronic design & engineering firm expands sales by automating PCB assembly
- Interview: Bernd Schenker—ERSA GmbH
- "Your Questions Answered at SMT Nuremberg 2008" by Bob Willis (European edition)
- "Challenging times ahead... Component orders may be exceeding end market demand" by
Walt Custer and Jon Custer-Topai
- Wear-out system reliability with multiple components and load levels" by
Werner Engelmaier
Download issue 8.7 - July 2008 today.
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Issue 8.26
July 10, 2008
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