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July 2008
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Challenging times ahead...
Component orders may be exceeding end market demand
Walt Custer and Jon Custer-Topai

Regional growth of electronic equipment, semiconductors and printed circuit boards provide timely insight into business conditions in the key electronic centers of the world. Chart 1 shows the 3-month growth of electronic equipment shipments by area. Note Taiwan/China’s large growth-decline (from +36.7% in October’07 to +14.7% in April’08). 14.7% growth is not bad, but for Taiwan & China it is the lowest level since early 2002! Read more...

Interview: Albert Bokma, Assembléon
Joe Fjelstad

When it comes to high-end chipshooters for high-volume applications, Assembléon is one of the first names that springs to mind. Albert Bokma is the chief commercial officer for Assembléon, based in The Netherlands. He speaks to Trevor Galbraith about Assembléon’s product range and its global operations. Read more...

KIC’s 24-7 continuous monitoring system helps Paramit meet zero defects objective

High-end, high-mix contract manufacturer Paramit sought a method of continuously monitoring their reflow process in order to bring it in line with their zero defects objective. According to Billoo Rataul, Paramit president and COO, "Prior to KIC, our reflow process was a black box. Now KIC 24-7 allows us to look at each and every board and issues a warning if we violate a spec limit, ensuring a zero-defect reflow process." KIC has also helped Paramit reduce the need to sacrifice boards when setting up reflow processes, with their Auto-Focus software tool. Watch the interview to learn more.

New Siplace coplanarity module now with
fast 3D sensors
Instead of with a laser dot, electronic components are now scanned with a laser line. Its scattered-light reflections are converted into height information by a powerful 3D sensor.

Quad ThinPRO electronic tape feeders
The ThinPRO feeder, available from PPM, has been designed to provide greater accuracy and performance for all your 0201/0402 component requirements.

PROMATION develops PASS/FAIL sorting magazine system for batch AOI
The SCUD-66PF accepts PASS/FAIL signals through a modified SMEMA interface and places the PCB into the proper magazine location (Good or Suspect) after inspection.

More Products News...

Asymtek promotes Roberta Foster-Smith to manager of global marketing communications
Foster-Smith brings over 20 years experience in marketing technical products and has been with Asymtek since 1995 as marketing communications manager.

Essemtec increases headquarters
Essemtec recently opened an architecturally interesting new building that includes not only production space but also office rooms and a large, friendly canteen.

Machine Vision Products promotes North American sales manager
Richard Osborne began as the central regional sales manager for Machine Vision Products (MVP) in 2005.

New OK International webinar
outlines best practice for effective soldering
The webinar ‘Unlocking the Myths of Heating Technology: A Practical Tutorial’ will be held on July 31st at 11am PDT, 2pm EDT and 6pm GMT.

IPC meetings in Berlin focus on high impact trends
shaping the electronics industry of the future
The IPC EMS Management Council Meeting and Executive Market & Technology Forum Conference will be held September 10 - 11, 2008.

More Industry News...
 

Inside the July 2008 issue of Global SMT & Packaging magazine:

• "Understanding hidden reactions and the importance of profile in reflow soldering, part 1" by Dr. S. Manian Ramkumar, Anand Kannabiran, Aarthi Baskaran, Dr. Viswam Puligandla, Bjorn Dahle
• "PCB production & test: Tips from pros on lead-free processes, part 1—issues in hot air solder levelling (HASL)" by Thomas Berger
• Case Study: Solder dross recycling: Tried, tested and proven at Kimball Electronics
• Case Study: Electronic design & engineering firm expands sales by automating PCB assembly
• Interview: Bernd Schenker—ERSA GmbH
• "Your Questions Answered at SMT Nuremberg 2008" by Bob Willis (European edition)
• "Challenging times ahead... Component orders may be exceeding end market demand" by Walt Custer and Jon Custer-Topai
• Wear-out system reliability with multiple components and load levels" by Werner Engelmaier

Download issue 8.7 - July 2008 today.

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