Lead-free processes for reflow and wave soldering are well documented, but this is not the case for hand soldering, which is still used for specialised electronic products. This article describes the selection of solder and board finishes that suit hand soldering and important issues affecting the choice. Read
more...
The consequences of inadequate soldering temperatures was previously touched upon in my GSMT&P column of August 2001. While inadequate peak reflow temperatures have been with us all along, the problem has become acute with the higher temperatures required for SAC solders. Given these much higher soldering temperatures, the tendency to solder at temperatures as low as possible, and sometimes below that, is driven by the maximum temperatures that some of the components and PCBs can tolerate. Read
more...
Werner Engelmaier will be giving some of his solder joint reliability and PCB reliability workshops at the SMTAI, August 17-19, 2008 in Orlando, FL, and the IPC Fall Meeting, September 21-24, 2008 in Schaumburg, IL; for details of the workshop go to www.engelmaier.com.
White Paper: Wafer Backside Coating
We’ve Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput
and Cost-Effective Advantages over Alternative Materials & Methods
by Davy Nakada, the electronics group of Henkel
While many advances in die attach methods and materials have taken center stage in recent months, there is one novel technology that has quietly emerged on the scene as, perhaps, one of the most innovative breakthroughs in die attach technology. The process, termed Wafer Backside Coating™, uses traditional materials deposition technologies—screen printing, stencil printing or spin coating—to efficiently coat the backside of wafers with die attach materials. The benefits of this technology include reduced costs, increased units per hour (UPH), tighter material control and the maximization of die footprint area through elimination of the fillet. Read more...
Slumping can occur when the ambient temperature in the workplace increases, which may happen during the summer periods when air conditioning is not available in the factory. Read more...
Serge Tuerlings joins the Kyzen team Mr. Tuerlings has extensive experience in both the chemical and electronics industry and comes to Kyzen from Kester Solder, where he held the position of European market development manager.
Mirtec opens new manufacturing facility
The new facility will enable Mirtec to continue to produce high-quality AOIs (Automated Optical Inspectors) at double the previous capacity.
Inside the July 2008 issue
of
Global SMT & Packaging magazine:
"Understanding hidden reactions and the importance of profile in reflow soldering, part 1" by Dr. S. Manian Ramkumar, Anand Kannabiran, Aarthi Baskaran, Dr. Viswam Puligandla, Bjorn Dahle
"PCB production & test: Tips from pros on lead-free processes, part 1—issues in hot air solder levelling (HASL)" by Thomas Berger
Case Study: Solder dross recycling: Tried, tested and proven at Kimball Electronics
Case Study: Electronic design & engineering firm expands sales by automating PCB assembly
Interview: Bernd Schenker—ERSA GmbH
"Your Questions Answered at SMT Nuremberg 2008" by Bob Willis (European edition)
"Challenging times ahead... Component orders may be exceeding end market demand" by
Walt Custer and Jon Custer-Topai
Wear-out system reliability with multiple components and load levels" by
Werner Engelmaier
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for the industry?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query,
contact Trevor Galbraith at editor@globalsmt.net.
