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Video News
Global Electronics Production Migrates
EU Commission Proposes 7 More RoHS Exemptions
SMT Nuremberg Report
Henkel Added to List of 'World's Most Ethical Companies'
Nordson Acquires Remaining 51% of Joint Venture
Ronald Lindell New Director of Global Sales & Mktg at VJ
Global SMT& Packaging
E-mail: news@globalsmt.net
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Editorial Staff
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Improving print performance using area ratio sensitivity analysis
Chris Anglin, Indium Corporation of America, Clinton, New York, USA
The purpose of a solder paste print evaluation is to observe variation in transfer efficiency to the assembly process under conditions that permit careful scrutiny.
This paper proposes a sensitivity analysis to deal with non-certain stencil aperture area ratios. The technique simplifies an explanation of a paste evaluation outcome. Using several common aperture dimensions with different stencil thicknesses, a solder paste evaluator can visually analyze the alternative aperture area ratios. Read
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Change in the electronics industry – slow but inevitable
Joe Fjelstad
Approaching four decades of working in the electronics interconnection industry, it appears to this observer that, when looking back over all those years, the electronics interconnection manufacturing industry has been on a treadmill of sorts and changing ever so slowly. Were a printed circuit process engineer from the late 1960s or early 1970s to be transported through time from back then to today, it is very likely that he or she could step into a job in a modern PCB shop with little training. This is because much of the way we process printed circuits today is virtually indistinguishable from practices used during those days. In short, we have been doing virtually the same things over and over for decades with little in the way of significant change. Read
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| SMT/HYBRID/PACKAGING 2008 |
Post-Show Report from Nuremberg
Trevor Galbraith
SMT/Hybrid/Packaging confirmed its position as the most consistent annual show in Europe. Over 600 exhibitors occupied a little under 30,000 sq. feet of space at the Nuremberg Messe. The number of foreign visitors increased over last year to over 34% of the 24,000+ who visited the three-day event. Highlights of the show included.... Read
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| Global SMT & Packaging magazine |
Inside the June 2008 issue of Global SMT & Packaging magazine:
- "Process and assembly methods for increased yield of PoP devices" by Brian Toleno, Ph.D., and Dan Maslyk
- "Suitable choices for lead-free hand soldering" by Shubo Gao and David M. Jacobson
- "Pushing the barriers of wafer level device integration" by
Gordon Christison
- Albert Bokma, interview—Assembléon
- Case Study: Are two heads really better than one?
- Inovar factory expansion – an American success story
- "Are we there yet? The ongoing journey to co-design of chip, package and substrate" by
Joe Fjelstad (North America edition)
- "Ball grid array & lead-free assembly defects, part 2" by
Bob Willis (Europe edition)
- "First quarter 12% global end market growth slowdown but no disaster on horizon" by
Walt Custer and Jon Custer-Topai
- "Inadequate peak reflow temperatures" by
Werner Engelmaier
Download issue 8.6 - June 2008 today.
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Issue 8.23
June 13, 2008
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