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Global SMT& Packaging
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Editorial Staff
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Nanotechnology and mathematical methods for high-performance thermal interface materials
Sara N. Paisner, PhD, LORD Corporation
Higher power chips have resulted from a variety of new developments in the electronics industry. While these state-of-the-art devices offer the benefit of more power, more heat is typically produced. Using a dense particle packing theory, a variety of thermal management materials have been introduced to the marketplace that exceed the performance of current commercially available greases, gels and adhesives to meet the new heat requirements. As compared to more traditional empirical scattershot approaches, this new method uses a mathematical tool to optimize formulations. The result of integrating this theory has not only helped produce new thermal materials, but it has dramatically reduced developmental time. Read
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Ball grid array & lead-free assembly defects, part 1
Bob Willis
Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes. We also feature some other lead-free defects in this two-part column leading up to the Process Advice & Defect Clinic in Nuremberg. Read
more...
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| National Electronics Week 2008 |
First National Electronics Week draws to a close
Andy Kellard, Global SMT & Packaging
As the show enters its final day there are mixed reports from exhibitors on the show floor regarding the general health of electronics manufacturing in the UK. Some suppliers have reported fairly difficult trading conditions in the UK market for the first half of 2008. Contrastingly, a significant number of other exhibitors were far more bullish, reporting robust sales and are confident in their outlook as we move into the second half of the year. Read
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| White Paper: Flux gets its fill |
Flux gets its fill: New epoxy flux material offers underfill protection
Bruce Chan, Robert Chu and Brian Toleno, the electronics group of Henkel
Though fluxing – or no-flow—underfills have been on the market for some time, the drawbacks of these older generation materials have prevented their widespread adoption. Challenges with performance and reliability often negate the in-line processing advantages of these materials. In a normal no-flow operation, the underfill is applied to the substrate prior to component placement and when the assembly passes through reflow, the material cures. But no-flows are susceptible to moisture outgassing from the substrate which results in voids. To alleviate this issue, manufacturers often select reflow-curable alternatives such as cornerbond and post-reflow cured edgebond materials that do not fully underfill the device. Read more...
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| Global SMT & Packaging magazine |
Inside the June 2008 issue of Global SMT & Packaging magazine:
- "Process and assembly methods for increased yield of PoP devices" by Brian Toleno, Ph.D., and Dan Maslyk
- "Suitable choices for lead-free hand soldering" by Shubo Gao and David M. Jacobson
- "Pushing the barriers of wafer level device integration" by
Gordon Christison
- Albert Bokma, interview—Assembléon
- Case Study: Are two heads really better than one?
- Inovar factory expansion – an American success story
- "Are we there yet? The ongoing journey to co-design of chip, package and substrate" by
Joe Fjelstad (North America edition)
- "Ball grid array & lead-free assembly defects, part 2" by
Bob Willis (Europe edition)
- "First quarter 12% global end market growth slowdown but no disaster on horizon" by
Walt Custer and Jon Custer-Topai
- "Inadequate peak reflow temperatures" by
Werner Engelmaier
Download issue 8.6 - June 2008 today.
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Issue 8.24
June 19, 2008
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