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June 2008
print magazine

Wafer-level cavity package with via-through pad interconnects
Giles Humpston, Tessera

The continued drive toward solid state imagers with greater pixel numbers and smaller pixels adversely affects yields, particularly through physical contamination during assembly of the camera module. The solution being progressively adopted by industry is to package the semiconductor die, preferably using wafer-level technology, owing to the favourable economics of the process. Read more...

Tools & Methods for
Lean Production Management in EA
Dr. T. Nguyen & Vern Harrison, EA

Lean manufacturing is far from a new concept, and many within the electronics assembly (EA) industry are already familiar with the principles and concepts behind it. In spite of widespread understanding, however, the percentage that actually 'live lean' within EA tends to be far less.

If 'lean' offers such a compelling business advantage, one must critically ask why it has not yet been adopted widely and successfully in the 'leading edge' EA industry? Fortunately, several technologies and tools available to the EA industry today offer new possibilities to realize a major impact as never before. Read more...

Cookson Electronics’ Engineered Products Group Launches “First-Time-Right” NPI Stencils Initiative
Cookson Electronics Assembly Materials is launching its “First-Time-Right” NPI (new product introduction) Stencils Initiative for its ALPHA® branded “Engineered Products” (stencils) product line.

Practical Dummy Components Announces Its Latest PoP Body Size
Because there is no expensive die inside the package, the cost for performing mechanical testing is significantly lower.

Anders Electronics delivers technology enabling the ultimate user experience
This latest addition to Anders’ intelligent display range joins the existing UMR-X10-35, which features the same embedded PC platform with a transflective 3.5-inch VGA LTPS TFT display.

More Products News...

CyberOptics’ Steve DiMarco Promoted to New Role Within Company
DiMarco will be responsible for CyberOptics’ new systems product development and manufacturing center in Singapore as well as global sales & marketing and service.

Time for the electronics industry to clean up its act?
Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system.

ECD Appoints KIE GmbH As New Distributor In Germany and Austria
Previously with Peter Jordon GmbH for thirty-five years, Mr. Kroschewski is well known in the industry, and brings a wealth of experience to serve ECD’s customers across a wide range of applications.

AIM Announces National Sales Manager Personnel Addition
Lauro Montalvo, who holds a degree in Electronics, brings over sixteen years of experience in soldering technologies to AIM.

More Industry News...
 

Inside the June 2008 issue of Global SMT & Packaging magazine:

• "Process and assembly methods for increased yield of PoP devices" by Brian Toleno, Ph.D., and Dan Maslyk
• "Suitable choices for lead-free hand soldering" by Shubo Gao and David M. Jacobson
• "Pushing the barriers of wafer level device integration" by Gordon Christison
• Albert Bokma, interview—Assembléon
• Case Study: Are two heads really better than one?
• Inovar factory expansion – an American success story
• "Are we there yet? The ongoing journey to co-design of chip, package and substrate" by Joe Fjelstad (North America edition)
• "Ball grid array & lead-free assembly defects, part 2" by Bob Willis (Europe edition)
• "First quarter 12% global end market growth slowdown but no disaster on horizon" by Walt Custer and Jon Custer-Topai
• "Inadequate peak reflow temperatures" by Werner Engelmaier

Download issue 8.6 - June 2008 today.

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