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February 2008
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Erik Bergum joins Heraeus CMD Assembly Materials business unit
Erik Bergum replaces John Snyder, who has assumed the role of director of business development for the unit.

E.H. Lim joins ECD to handle Asian Business
ECD has appointed former Vitronics-Soltec sales director Mr. E.H. Lim to handle sales and channel management in Asia. 

Kyzen to feature its award-winning MICRONOX MX2302 at SEMICON China 2008
Kyzen Corporation will exhibit its award-winning, advanced technology MICRONOX MX2302 wafer-level cleaning solution in two representative ’s booths during the SEMICON China Exhibition and Conference: WKK’s booth 2636 and Sigmatek’s booth 3725.

Nihon Superior paper to be presented
Nihon Superior's paper on impact strength for BGA lead-free solder spheres will be presented at the TMS Conference.

IPC releases PCB industry results for January 2008
Rigid PCB shipments are up 5.6 percent and bookings are up 13.7 percent in January 2008 from January 2007. 

SMTA accepting applications for $5,000 Charles Hutchins Educational Grant
The grant will be presented at the SMTA Annual Meeting held in conjunction with the SMTA International Conference in Orlando, Florida August 17-21, 2008.

More Industry News...

 

Pin in paste stencil design for notebook mainboard

This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. Read more...

Stan Renals interview

As part of Cobar’s strategy to significantly increase global market share, they have made an important move with the appointment of Stan Renals as COO. Read more...

Cobar Solder Products now offers bar solder, wire, SN100C alloys to US market
Cobar Solder Products, now part of the Balver Zinn Group, announces the availability of bar solder (for wave, selective, tinning, and similar applications) and other solder products, including SN100C alloys, to complement its product offering of solder pastes, fluxes, and cored wire solders to US electronics manufacturers.

Cookson Electonics launches ALPHA® OM-350 lead-free solder paste with InnoLot alloy
Cookson Electronics Assembly Materials is launching its new ALPHA® OM-350 lead-free solder paste with the unique, patented InnoLot lead-free alloy formulation developed for use in applications in which extreme temperature ranges and high vibration are common.

PROMATION introduces SCBL-77G passageway gate system
The SCBL-77G combines a small footprint passageway station with a vertical buffering station to allow for continued production even with the gate is in use.

More Products News...

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