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Video News
APEX
Shanghai Takes a Step Closer
LG
Engineer Charged with $1.4 Billion Technology Theft
Police
Raid 51 Exhibits at CeBit
Elcoteq
Manufacturing Improvements
GPS
Driving Growth in 2008
Romania
is the Hottest New Location in Central Europe
New
Fast-Curing Conductive Epoxy Adhesive
Trident
Launches Inkjet for Printed Electronics
Celestica
Outbids Foxconn for GN Netcom Contract
CeBit
Goes Green
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BTU
receives record-breaking order for Pyramax products from leading semiconductor
company
The multiple machine order, valued at nearly three million dollars, will be used
to upgrade the customer’s existing installed base of advanced semiconductor
packaging equipment.
SMT/Hybrid/Packaging
2008 to be biggest show yet
The total space booked so far for this year’s SMT/HYBRID/PACKAGING, set
to take place from 3 to 5 June 2008 in Nuremberg, has exceeded all previous
SMT/HYBRID/PACKAGING events.
IPC Innovative
Technology Center winners announced
IPC — Association Connecting Electronics Industries® announced the
products that will be featured in the Innovative Technology Center (ITC) at
the 2008 IPC Printed Circuits Expo®, APEX® and the Designers Summit.
Sono-Tek Creates
two strategic business units, expands resources
Sono-Tek Corporation announces the creation of two strategic business units
(SBU) reporting directly to Dr. Joseph Riemer, president, as well as the hiring
of additional sales and applications development staff.
Nihon superior
to collaborate with University of Queensland
An agreement covering this collaboration was signed on February 7, 2008.
SMTA announces “Best
of Conference” award for Pan Pacific 2008 Symposium
As rated by the attendees, the “Best of Conference” award was given
to two presenters this year.
More
Industry News...
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Sobering
thoughts for 2008
Recession fears continue in the USA following last summer’s housing/sub-prime
mortgage mess, made worse by higher oil prices, and then accelerating
as both consumer and business spending has been curtailed. Read
more...
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Full
metal TIMs
Robert N. Jarrett, Jordan P. Ross, Ross Berntson
Metal thermal interface materials (TIMs) offer substantially higher thermal
conductivity than other commercially available TIMs. Read
more...
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Issue 8.10
/ Mar 13, 2008
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